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Exhibiting with the theme of OKUNO's technology contributing to the development of electronics!

Okuno Pharmaceutical Industry's technical consultation desk for surface treatment and plating offers solutions to your problems related to semiconductor packaging and assembly.

■JPCA Show 2023 / Exhibition of Semiconductor Packaging and Embedded Component Technologies■ Okuno Pharmaceutical Industry will be exhibiting at the Semiconductor Packaging Exhibition within JPCA Show 2023, which will be held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers, package substrates, printed circuit boards, and FPCs, as well as plating processes for power modules and glass materials for electronic components. Please visit our booth at Tokyo Big Sight, East Hall 6, 6C-05. ■Introducing Products for Printed Circuit Boards / Semiconductor Package Substrates■ To help you learn more about us, we will introduce our products for printed circuit boards and semiconductor package substrates. If you have any questions regarding surface treatment, please feel free to contact us. *For more details, please download the PDF or contact us directly.*

  • Surface treatment contract service
  • Other contract services

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"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 2-1

Progress in the Development of Non-Cyanide Silver Plating Solution 1

■Safe and Secure Silver Plating Currently, the mainstream silver plating used in industrial applications is cyanide plating baths, which were invented in 1838 by G.R. Elkington in the UK. Since then, cyanide compounds have been used for about 180 years and are still widely utilized today. This is because cyanide forms very stable complexes with many metals and can create dense and uniform coatings, making it not only used for silver plating but also for zinc plating, copper plating, and gold plating for a long time. However, the strong toxicity of cyanide poses many issues regarding occupational safety and wastewater treatment, leading to the early development of "non-cyanide plating solutions" in the plating industry. *For more details, please refer to the related links below.*

  • Other metal materials

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[Safe and Secure] Non-Cyanide Silver Plating Solution "Dine Silver" 3-2

Features of "Dine Silver" that are friendly to people and the Earth 2

Using non-cyanide silver plating solutions that exceed cyanide without using cyanide The non-cyanide silver plating solution has been developed with the perspective of being equivalent to cyanide baths, but now it adds performance not found in cyanide baths, improving economic efficiency and convenience. ● It has good long-term stability, and there is no need to renew the bath due to the accumulation of carbonates seen in cyanide baths. ● For copper-based materials, good adhesion can be achieved even without a strike silver plating. ● It can be operated over a wide pH range (3 to 10). Plating is possible on materials coated with resist films that are susceptible to alkalis. ● Various plating methods such as rack plating, barrel plating, and continuous plating can be applied. ● A uniform white matte or semi-gloss silver plating can be obtained. ● Properties such as solderability, contact electrical resistance, and hardness are equivalent to those of cyanide baths. *Continued from "Basic Information"*

  • Other metal materials

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"Safe and Secure" Non-Cyanide Silver Plating Solution "Dine Silver" 4

Characteristics, Uses, and Lineup of "Dain Silver"

■Characteristics of Non-Cyan Silver Plating Solution "Dine Silver" ● High safety due to the complete absence of cyanide compounds, making wastewater treatment easy. ● A non-alkaline type compatible with resist substrates is available. ● Reduction of production processes is possible. A type that does not require stripe plating is also available. ● Coating characteristics and bath application conditions are equivalent to cyan silver plating; silver anode use is acceptable. ■Compatible with Various Applications Supports rack, barrel, hoop, electroforming, pulse, and jet plating. Compatible with semiconductor lead frames and other electronic component plating. *For more details, please refer to the related links and catalog below.

  • Other metal materials

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